The process of placing an IC chip onto a flexible circuit board creates a variety of choices; such as the shape of a flexible circuit board, the mounting location of the IC chip, and the bending point of the flexible circuit board. Plus, it is easy to embed onto application devices.

The process of placing an IC chip onto a glass substrate is a simple structure and suitable for small-sized OLED panels. This method makes it possible for a variety of designing flexible circuit boards.

The process of placing an IC chip onto a tape printed circuit board allows the mounting location of the IC chip and the bending point of the tape printed circuit board to be fixed.